科学研究
| 论文题目 | 作者 | 刊物名称 | 发表年度 |
|---|---|---|---|
| A zero‐current‐transition soft‐switching technique for T‐Type NPC three‐level inverter | Jingyuan Yin,Xiuyuan Yao,Jinke Li | IET Power Electronics | 2022 |
| Improved Sinc Method Based on POD Technique for Time Domain Electromagnetic Field Problems | Ze Guo, Zuqi Tang, Shuai Yan, Zhuoxiang Ren | The 23rd International Conference on the Computation of Electromagnetic Fields COMPUMAG 2021 | 2022 |
| Combined Euler-Lagrange Approach for the Stability Analysis of Moving Structure in Electromagnetic Field | Ze Guo, Shuai Yan, Xiaoyu Xu, Zhifu Chen, Zhuoxiang Ren | The 23rd International Conference on the Computation of Electromagnetic Fields COMPUMAG 2021 | 2022 |
| 考虑转子偏心的永磁同步电机数字孪生模型 | 郭泽, 闫帅, 任卓翔 | 第十届电工技术前沿问题学术论坛 | 2022 |
| 齿轮感应淬火的多时间尺度电磁-热多物理耦合分析研究 | 郑天宇, 周亚星, 靳剑钊 | 第18届中国CAE工程分析技术年会 | 2022 |
| Reduced-Order Model Based on POD and Polynomial Fitting for Parametric Magnetostatic Field Problem | Erde Wang, Xiaoyu Xu, Shuai Yan, Xiaotong Fu, Zhuoxiang Ren | IEEE CEFC 2022, 20th Biennial IEEE Conference on Electromagnetic Field Computation | 2022 |
| A Hybrid Iterative-Direct Solver Based On Fast Multipole Method For Efficient Finite Element-Boundary Element Coupling Analysis | Ning Zhang, Shuai Yan, Zhuoxiang Ren | IEEE CEFC 2022, 20th Biennial IEEE Conference on Electromagnetic Field Computation | 2022 |
| Twin-model based on model order reduction for rotating motors | Ze Guo, Shuai Yan, Xiaoyu Xu, Zhifu Chen, Zhuoxiang Ren | IEEE Transactions on Magnetics | 2022 |
| Integration parameters optimization of low-voltage multi-terminal DC system under access of electric vehicles | Wei Deng, Wei Pei, Ying Zhuang, Li Kong, Qiang Li, Yubo Yuan | IET Smart Grid | 2021 |
| 有序结构AgO电极材料的制备与形成机理 | 张贺，屈飞 | 硅酸盐学报 | 2021 |
| SF6 替代气体分解特性的研究综述 | 周朕蕊, 韩 冬, 赵明月, 张国强 | 电工技术学报 | 2021 |
| 电晕放电下C5F10O 混合气体的分解特性 | 周朕蕊, 韩 冬, 赵明月, 张国强 | 电工技术学报 | 2021 |
| Study on image alignment technology based on CCD thermal reflection method | 杨鹤、司维康、王大正、高莹莹、郑利兵 | 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) | 2021 |
| Thermal Analysis of High-Power Light-Emitting Diode Using Thermoreflectance Thermography | 王大正、郑利兵、司维康、杨鹤、高莹莹 | 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) | 2021 |
| Analysis on characteristics emission spectrum of SF6 under 50Hz AC corona discharge | Beibei Tang, Dong Han, Yanfei Li, Kang Li, Zongjia Qiu, Guoqiang Zhang | 2021 IEEE Electrical Insulation Conference (EIC) | 2021 |
| The influence of electrode materials on the emission spectrum in SF6 under AC corona discharge | Yanfei Li, Dong Han, Beibei Tang, Kang Li, Zongjia Qiu, Guoqiang Zhang | 2021 IEEE Electrical Insulation Conference (EIC) | 2021 |
| 基于原子层沉积技术的高精度多层膜X？射线 菲涅尔波带片的制备研究,？光子学报,？2021年, | 吴鹿杰，文庆涛，高雅增，卢维尔，夏洋，李艳丽，孔祥东， 韩立 | 光子学报 | 2021 |
| 应用于功率芯片封装的瞬态液相扩散连接材料与接头可靠性研究进展 | 刘璇，徐红艳*，李红*，徐菊，Ｈｏｄúｌｏｖá Ｅｒｉｋａ， Ｋｏｖａｒˇíｋｏｖá Ｉｎｇｒｉｄ | 材料导报 | 2021 |
| Design, simulation and experimental verification of heat transfer structure in thermoelectric cooling helmets | Zhaoshen Tian, Ju Xu* | E3S Web of Conferences | 2021 |
| Microstructure and mechanical characteristics of a novel Cu/Cu3Sn joint with Cu/Sn preform | ？ Hongyan Xu，Wei Zhang, Xuan Liu, Ju Xu* | 22nd International Conference on Electronic Packaging Technology (ICEPT) | 2021 |