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| 论文题目: | Thermal Analysis of High-Power Light-Emitting Diode Using Thermoreflectance Thermography |
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| 作者: | 王大正、郑利兵、司维康、杨鹤、高莹莹 |
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| 刊物名称: | 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) |
| 年: | 2021 |
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Thermal Analysis of High-Power Light-Emitting Diode Using Thermoreflectance Thermography