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| 论文题目: | Studies on the Effects of Soldering Layer Structures on TEe Module Performance and Thermal Stress |
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| 作者: | Dianru Yu, Zhihao Yin, Guanghui Liu, Hongyan Xu, Ju Xu* |
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| 刊物名称: | 22nd International Conference on Electronic Packaging Technology (ICEPT) |
| 年: | 2021 |
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Studies on the Effects of Soldering Layer Structures on TEe Module Performance and Thermal Stress