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| 论文题目: | Fabrication of Cu@Sn TLPS joint for high temperature power electronics application |
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| 作者: | Honghui Zhang, Hongyan Xu*, Xuan Liu and Ju Xu |
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| 刊物名称: | RSC Adances |
| 年: | 2022 |
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Fabrication of Cu@Sn TLPS joint for high temperature power electronics application