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| 论文题目: | Preparation and Performance of semiconductor device bonding joints based on Cu@Sn@Ag die attaching material |
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| 作者: | Honghui Zhang, Hongyan Xu*, Sheng Wang, Tianwen Wang |
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| 刊物名称: | RSC Advances |
| 年: | 2023 |
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Preparation and Performance of semiconductor device bonding joints based on Cu@Sn@Ag die attaching material