Regulated Thermal Boundary Conductance between Copper and Diamond through Nanoscale Interfacial Rough Structures
论文编号:
第一作者所在部门:
论文题目: Regulated Thermal Boundary Conductance between Copper and Diamond through Nanoscale Interfacial Rough Structures
论文题目英文:
作者: Ziyang Wang, Fangyuan Sun,* Zihan Liu, Libing Zheng, Dazheng Wang, and Yanhui Feng*
论文出处:
刊物名称: Acs Applied Materials & Interfaces
: 2023
:
:
:
联系作者:
收录类别:
影响因子:
摘要:
英文摘要:
外单位作者单位:
备注: