| 论文编号: | 0 |
| 第一作者所在部门: | 0 |
| 论文题目: | Investigation on thermal stress of bondline based on Cu@Sn preform at high temperature application |
| 论文题目英文: | |
| 作者: | Xu, Hongyan; Ning, Puqi; Zheng, Libing; Xu, Ju; Zhang, Shuting |
| 论文出处: | 0 |
| 刊物名称: | 2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019 |
| 年: | 2020 |
| 卷: | 0 |
| 期: | 0 |
| 页: | 0 |
| 联系作者: | 0 |
| 收录类别: | |
| 影响因子: | 0 |
| 摘要: | 0 |
| 英文摘要: | |
| 外单位作者单位: | 0 |
| 备注: | 0 |
Investigation on thermal stress of bondline based on Cu@Sn preform at high temperature application